🇨🇳 Article en anglais
Chinese storage makers, long known for packaging chips into modules, have been moving up the value chain into wafer-level operations, with the latest firm to make the jump investing 4.5 billion yuan (US$672 million) in an advanced packaging project. The sum, which Shanghai-listed Biwin Storage Technology will pour into the third phase of
Source : South China Morning Post. Le Fil Indépendant cite et lie cet article ; il n'en est ni l'auteur ni l'éditeur.