Se rendre au contenu

Japan’s Sumitomo Bakelite expands China chip packaging materials output amid AI boom

11 octobre 2026 par
Japan’s Sumitomo Bakelite expands China chip packaging materials output amid AI boom

Japan’s Sumitomo Bakelite expands China chip packaging materials output amid AI boom

🇨🇳 Article en anglais

Japanese semiconductor materials giant Sumitomo Bakelite plans to expand production of advanced chip packaging materials in China and Singapore, marking the second such announcement for its Chinese operations in less than four months as artificial intelligence drives demand for more sophisticated semiconductors. The Tokyo-based company sa

Read the original article

Source : South China Morning Post. Le Fil Indépendant cite et lie cet article ; il n'en est ni l'auteur ni l'éditeur.

Ebola spreads in eastern DRC as Kenya confirms imported case